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Cu ÷°¡°¡ Mo-Cu-N ÄÚÆÃÀÇ ¹Ì¼¼±¸Á¶¿Í ±â°èÀû Ư¼º¿¡ ¹ÌÄ¡´Â ¿µÇâ
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Effect of microstructures on the shrinkage of injection molding product
³í¹®Áý : JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY
JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY
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Development of a triboelectric nanogenerator with enhanced electrical output performance by embedding electrically charged microparticles
³í¹®Áý : Çѱ¹º¹ÇÕÀç·áÇÐȸ(Functional Composites and Structures)
Çѱ¹º¹ÇÕÀç·áÇÐȸ(Functional Composites and Structures)
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°î¼±Çü Çü»óÀûÀÀÇü ³Ã°¢Ã¤³ÎÀ» °®´Â ±ÝÇü ÄÚ¾î Á¦ÀÛÀ» À§ÇÑ DMT °øÁ¤°³¹ß
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Optimizing the magnetic properties of Fe-based amorphous powder by adjusting atomic structures from vitrification at different temperatures
³í¹®Áý : JOURNAL OF APPLIED PHYSICS
JOURNAL OF APPLIED PHYSICS
65
Effect of Laser-Induced Direct Micropatterning on Polymer Optoelectronic Devices
³í¹®Áý : ACS APPLIED MATERIALS & INTERFACES
ACS APPLIED MATERIALS & INTERFACES
64
Investigation of novel metal additive manufacturing process using plasma electron beam based on powder bed fusion
³í¹®Áý : CIRP ANNALS-MANUFACTURING TECHNOLOGY
CIRP ANNALS-MANUFACTURING TECHNOLOGY
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A Study on Activation Algorithm of Finite Elements for Three-Dimensional Transient Heat Transfer Analysis of Directed Energy Deposition Process
³í¹®Áý : INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING
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Where does the money go in related party transactions? Evidence from Korean chaebol affiliated firms
³í¹®Áý : The Asian International Journal of Life Sciences
The Asian International Journal of Life Sciences
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Æó¸®Æ¬ÀÌÂ÷ÀüÁö¿¡¼ ȸ¼öÇÑ Åº»ê¸®Æ¬À¸·ÎºÎÅÍ 2-step ħÀü°øÁ¤À» ÀÌ¿ëÇÑ °í¼øµµ ¼ö»êȸ®Æ¬ ºÐ¸» Á¦Á¶ ¿¬±¸
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Flexible and Stretchable PEDOT-Embedded Hybrid Substrates for Bioengineering and Sensory Applications
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CHEMNANOMAT
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Void fraction of a Sn?Ag?Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability
³í¹®Áý : JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
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