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70 Cu ÷°¡°¡ Mo-Cu-N ÄÚÆÃÀÇ ¹Ì¼¼±¸Á¶¿Í ±â°èÀû Ư¼º¿¡ ¹ÌÄ¡´Â ¿µÇâ
³í¹®Áý : Çѱ¹Ç¥¸é°øÇÐȸÁö
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69 Effect of microstructures on the shrinkage of injection molding product
³í¹®Áý : JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY
JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY
68 Development of a triboelectric nanogenerator with enhanced electrical output performance by embedding electrically charged microparticles
³í¹®Áý : Çѱ¹º¹ÇÕÀç·áÇÐȸ(Functional Composites and Structures)
Çѱ¹º¹ÇÕÀç·áÇÐȸ(Functional Composites and Structures)
67 °î¼±Çü Çü»óÀûÀÀÇü ³Ã°¢Ã¤³ÎÀ» °®´Â ±ÝÇü ÄÚ¾î Á¦ÀÛÀ» À§ÇÑ DMT °øÁ¤°³¹ß
³í¹®Áý : Çѱ¹±â°è°¡°øÇÐȸÁö
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66 Optimizing the magnetic properties of Fe-based amorphous powder by adjusting atomic structures from vitrification at different temperatures
³í¹®Áý : JOURNAL OF APPLIED PHYSICS
JOURNAL OF APPLIED PHYSICS
65 Effect of Laser-Induced Direct Micropatterning on Polymer Optoelectronic Devices
³í¹®Áý : ACS APPLIED MATERIALS & INTERFACES
ACS APPLIED MATERIALS & INTERFACES
64 Investigation of novel metal additive manufacturing process using plasma electron beam based on powder bed fusion
³í¹®Áý : CIRP ANNALS-MANUFACTURING TECHNOLOGY
CIRP ANNALS-MANUFACTURING TECHNOLOGY
63 A Study on Activation Algorithm of Finite Elements for Three-Dimensional Transient Heat Transfer Analysis of Directed Energy Deposition Process
³í¹®Áý : INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING
62 Where does the money go in related party transactions? Evidence from Korean chaebol affiliated firms
³í¹®Áý : The Asian International Journal of Life Sciences
The Asian International Journal of Life Sciences
61 Æó¸®Æ¬ÀÌÂ÷ÀüÁö¿¡¼­ ȸ¼öÇÑ Åº»ê¸®Æ¬À¸·ÎºÎÅÍ 2-step ħÀü°øÁ¤À» ÀÌ¿ëÇÑ °í¼øµµ ¼ö»êÈ­¸®Æ¬ ºÐ¸» Á¦Á¶ ¿¬±¸
³í¹®Áý : ÀÚ¿ø¸®½ÎÀÌŬ¸µ(JOURNAL OF THE KOREAN INSTITUTE OF RESOURCES RECYCLING)
ÀÚ¿ø¸®½ÎÀÌŬ¸µ(JOURNAL OF THE KOREAN INSTITUTE OF RESOURCES RECYCLING)
60 ½º¸¶Æ®±â±â È¿¿ëÀÇ ºÎÁ¤Àû ÀüÀÌ: IT±â¹Ý ¾÷¹« À¯¿¬¼º, ±Ù¹«½Ã°£ ¿Ü ¾÷¹« ¿¬°á¼º, ÀÏ-»î °¥µî¿¡ °üÇÑ ½ÇÁõ ¿¬±¸
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59 Flexible and Stretchable PEDOT-Embedded Hybrid Substrates for Bioengineering and Sensory Applications
³í¹®Áý : CHEMNANOMAT
CHEMNANOMAT
58 À¯¿¬Àü±ØÀÇ ÇöóÁ ¹ß»ý¿ë Àü¿ø½Ã½ºÅÛ À§ÇÑ ÇÏÀ̺긮µå Á¦¾î ±â¹ý¿¡ ´ëÇÑ ¿¬±¸
³í¹®Áý : Çѱ¹Áö´É½Ã½ºÅÛÇÐȸ ³í¹®Áö
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57 CNC ¸Ó½Ã´×¼¾ÅÍÀÇ ½ºÇɵéºÎÇϸ¦ ÀÌ¿ëÇÑ ¹ý¼±¹æÇâ Àý»è·Â ÃßÁ¤
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56 Void fraction of a Sn?Ag?Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability
³í¹®Áý : JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
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