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1600 |
Die to Wafer Hybrid BondingÀ» À§ÇÑ Flexure Àû¿ë Bond head °³¹ß
³í¹®Áý : ¹ÝµµÃ¼µð½ºÇ÷¹À̱â¼úÇÐȸÁö(JOURNAL OF THE SEMICONDUCTOR & DISPLAY TECHNOLOGY)
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¹ÝµµÃ¼µð½ºÇ÷¹À̱â¼úÇÐȸÁö(JOURNAL OF THE SEMICONDUCTOR & DISPLAY TECHNOLOGY) |
1599 |
º¼Æ®Çü ÇÇ¿¡Á¶ ¼¾¼¸¦ È°¿ëÇÑ ÇǾî½Ì ÆÝÄ¡ÀÇ ¾ó¶óÀθÕÆ® ºÒ·® °ËÃâ¿¡ °üÇÑ ¿¬±¸
³í¹®Áý : Çѱ¹±ÝÇü°øÇÐȸÁö(JOURNAL OF THE KOREA SOCIETY OF DIE & MOULD ENGINEERING)
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Çѱ¹±ÝÇü°øÇÐȸÁö(JOURNAL OF THE KOREA SOCIETY OF DIE & MOULD ENGINEERING) |
1598 |
Çöó½ºÆ½ Áß°øºÎÇ°ÀÇ ÀÏÃ¼È ¼ºÇüÀ» À§ÇÑ Àθôµå ÆÝĪ °øÁ¤±â¼ú¿¡ °üÇÑ ¿¬±¸
³í¹®Áý : Çѱ¹±ÝÇü°øÇÐȸÁö(JOURNAL OF THE KOREA SOCIETY OF DIE & MOULD ENGINEERING)
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Çѱ¹±ÝÇü°øÇÐȸÁö(JOURNAL OF THE KOREA SOCIETY OF DIE & MOULD ENGINEERING) |
1597 |
¸ÖƼ-¸ð´Þ ÀΰøÁö´ÉÀ» È°¿ëÇÑ ¹°Ç° Á¶¸³ ·Îº¿
³í¹®Áý : ·Îº¿°ú Àΰ£
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·Îº¿°ú Àΰ£ |
1596 |
Èí¼öºÐ±¤¹ý°ú Åä¸ð±×·¡ÇÇ ±â¹ýÀ» ÀÌ¿ëÇÑ Àü±â·Î ³»ºÎ ºñ±ÕÀÏ ¿µ¿ª ¿Âµµ ¹× ³óµµ ÃøÁ¤¿¡ ´ëÇÑ ¿¬±¸
³í¹®Áý : ¿¡³ÊÁö±âÈĺ¯ÈÇÐȸÁö(JOURNAL OF ENERGY&CLIMATE CHANGE)
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¿¡³ÊÁö±âÈĺ¯ÈÇÐȸÁö(JOURNAL OF ENERGY&CLIMATE CHANGE) |
1595 |
ÆÄÀå °¡º¯Çü ·¹ÀÌÀú Èí¼ö ºÐ±¤¹ýÀ» ÀÌ¿ëÇÑ NO »êÈ °úÁ¤ ³» °¡½º ³óµµ º¯µ¿ ºÐ¼®
³í¹®Áý : ¿¡³ÊÁö±âÈĺ¯ÈÇÐȸÁö(JOURNAL OF ENERGY&CLIMATE CHANGE)
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¿¡³ÊÁö±âÈĺ¯ÈÇÐȸÁö(JOURNAL OF ENERGY&CLIMATE CHANGE) |
1594 |
ÆÐÅ°Áö Àμ⿡ ÀÖ¾î¼ Kubelka-Munk Model À¯·¡ÀÇ »ê¶õ ¹× Èí¼ö °è¼ö¸¦ ÀÌ¿ëÇÑ »ö»ó ÀçÇö¼º ¿¹Ãø
³í¹®Áý : Çѱ¹Æ÷ÀåÇÐȸÁö(JOURNAL OF KOREA SOCIETY OF PACKAGING SCIENCE & TECHNOLOGY)
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Çѱ¹Æ÷ÀåÇÐȸÁö(JOURNAL OF KOREA SOCIETY OF PACKAGING SCIENCE & TECHNOLOGY) |
1593 |
ź¼Ò º¹ÇÕÀç ±â¹Ý ÀüÀÚÆÄ Â÷Æó ¹× °í¹æ¿ ÀÏüÇü Çʸ§ ¿¬±¸µ¿Çâ
³í¹®Áý : ¸¶ÀÌÅ©·ÎÀüÀÚ ¹× ÆÐŰ¡ÇÐȸÁö(JORNAL OF THE MICROELECTRONICS AND PACKAGING SOCIETY)
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¸¶ÀÌÅ©·ÎÀüÀÚ ¹× ÆÐŰ¡ÇÐȸÁö(JORNAL OF THE MICROELECTRONICS AND PACKAGING SOCIETY) |
1592 |
Improved Adhesion of DLC Films by using a Nitriding Layer on AISI H13 Substrate
³í¹®Áý : Çѱ¹Ç¥¸é°øÇÐȸÁö(JOURNAL OF THE KOREAN INSTITUTE OF SURFACE ENGINEERING)
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Çѱ¹Ç¥¸é°øÇÐȸÁö(JOURNAL OF THE KOREAN INSTITUTE OF SURFACE ENGINEERING) |
1591 |
¾Ï¹Ý Ä¿Æà ½ºÇø®Æà °ø¹ýÀÇ ÀûÁ¤ ¾ÐÀÔ·Â Ãß»êÀ» À§ÇÑ ºÐ¼®ÇØ
³í¹®Áý : Åͳΰú ÁöÇÏ°ø°£(TUNNEL AND UNDERGROUND SPACE)
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Åͳΰú ÁöÇÏ°ø°£(TUNNEL AND UNDERGROUND SPACE) |
1590 |
ÀÏÃà¾ÐÃà°µµ¿¡ ¹ÌÄ¡´Â ¾Ï¼®½ÃÆíÀÇ Çü»óÈ¿°ú °íÂû ¹× ·ÎµåÇì´õ ±¼ÁøÀ² ¿¹Ãø¸ðµ¨ ¼öÁ¤
³í¹®Áý : Åͳΰú ÁöÇÏ°ø°£(TUNNEL AND UNDERGROUND SPACE)
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Åͳΰú ÁöÇÏ°ø°£(TUNNEL AND UNDERGROUND SPACE) |
1589 |
Highly sensitive, selective, and rapid response colorimetric chemosensor for naked eye detection of hydrogen sulfide gas under versatile conditions: Solution, thin-film, and wearable fabric
³í¹®Áý : SENSORS AND ACTUATORS B-CHEMICAL
|
SENSORS AND ACTUATORS B-CHEMICAL |
1588 |
Review on the Wire Arc Additive Manufacturing Process and Trends in Non-ferrous Alloys
³í¹®Áý : ´ëÇÑ¿ëÁ¢Á¢ÇÕÇÐȸÁö(JOURNAL OF WELDING AND JOINING)
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´ëÇÑ¿ëÁ¢Á¢ÇÕÇÐȸÁö(JOURNAL OF WELDING AND JOINING) |
1587 |
Dimension Precision and Uniformability Depending on the Interpass Distance Variation of Automated-Wire Arc Additive Manufacturing using 5 Cr-4 Mo Tool Steel Alloy
³í¹®Áý : ´ëÇÑ¿ëÁ¢Á¢ÇÕÇÐȸÁö(JOURNAL OF WELDING AND JOINING)
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´ëÇÑ¿ëÁ¢Á¢ÇÕÇÐȸÁö(JOURNAL OF WELDING AND JOINING) |
1586 |
»çÃ⼺Çü°øÁ¤¿¡¼ CAE ±â¹Ý Ç°Áú µ¥ÀÌÅÍ¿Í ½ÇÇè µ¥ÀÌÅÍÀÇ ÅëÇÕ ÇнÀÀ» ÅëÇÑ ÀΰøÁö´É Ç°Áú ¿¹Ãø ¸ðµ¨ ±¸Ãà¿¡ ´ëÇÑ ¿¬±¸
³í¹®Áý : Çѱ¹±ÝÇü°øÇÐȸÁö(JOURNAL OF THE KOREA SOCIETY OF DIE & MOULD ENGINEERING)
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Çѱ¹±ÝÇü°øÇÐȸÁö(JOURNAL OF THE KOREA SOCIETY OF DIE & MOULD ENGINEERING) |