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³í¹®ÀÚ·á ´Ù¿î·Îµå Àüü °Ô½Ã¹° : 4165 °Ç
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1600 Die to Wafer Hybrid BondingÀ» À§ÇÑ Flexure Àû¿ë Bond head °³¹ß
³í¹®Áý : ¹ÝµµÃ¼µð½ºÇ÷¹À̱â¼úÇÐȸÁö(JOURNAL OF THE SEMICONDUCTOR & DISPLAY TECHNOLOGY)
¹ÝµµÃ¼µð½ºÇ÷¹À̱â¼úÇÐȸÁö(JOURNAL OF THE SEMICONDUCTOR & DISPLAY TECHNOLOGY)
1599 º¼Æ®Çü ÇÇ¿¡Á¶ ¼¾¼­¸¦ È°¿ëÇÑ ÇǾî½Ì ÆÝÄ¡ÀÇ ¾ó¶óÀθÕÆ® ºÒ·® °ËÃâ¿¡ °üÇÑ ¿¬±¸
³í¹®Áý : Çѱ¹±ÝÇü°øÇÐȸÁö(JOURNAL OF THE KOREA SOCIETY OF DIE & MOULD ENGINEERING)
Çѱ¹±ÝÇü°øÇÐȸÁö(JOURNAL OF THE KOREA SOCIETY OF DIE & MOULD ENGINEERING)
1598 Çöó½ºÆ½ Áß°øºÎÇ°ÀÇ ÀÏüȭ ¼ºÇüÀ» À§ÇÑ Àθôµå ÆÝĪ °øÁ¤±â¼ú¿¡ °üÇÑ ¿¬±¸
³í¹®Áý : Çѱ¹±ÝÇü°øÇÐȸÁö(JOURNAL OF THE KOREA SOCIETY OF DIE & MOULD ENGINEERING)
Çѱ¹±ÝÇü°øÇÐȸÁö(JOURNAL OF THE KOREA SOCIETY OF DIE & MOULD ENGINEERING)
1597 ¸ÖƼ-¸ð´Þ ÀΰøÁö´ÉÀ» È°¿ëÇÑ ¹°Ç° Á¶¸³ ·Îº¿
³í¹®Áý : ·Îº¿°ú Àΰ£
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1596 Èí¼öºÐ±¤¹ý°ú Åä¸ð±×·¡ÇÇ ±â¹ýÀ» ÀÌ¿ëÇÑ Àü±â·Î ³»ºÎ ºñ±ÕÀÏ ¿µ¿ª ¿Âµµ ¹× ³óµµ ÃøÁ¤¿¡ ´ëÇÑ ¿¬±¸
³í¹®Áý : ¿¡³ÊÁö±âÈĺ¯È­ÇÐȸÁö(JOURNAL OF ENERGY&CLIMATE CHANGE)
¿¡³ÊÁö±âÈĺ¯È­ÇÐȸÁö(JOURNAL OF ENERGY&CLIMATE CHANGE)
1595 ÆÄÀå °¡º¯Çü ·¹ÀÌÀú Èí¼ö ºÐ±¤¹ýÀ» ÀÌ¿ëÇÑ NO »êÈ­ °úÁ¤ ³» °¡½º ³óµµ º¯µ¿ ºÐ¼®
³í¹®Áý : ¿¡³ÊÁö±âÈĺ¯È­ÇÐȸÁö(JOURNAL OF ENERGY&CLIMATE CHANGE)
¿¡³ÊÁö±âÈĺ¯È­ÇÐȸÁö(JOURNAL OF ENERGY&CLIMATE CHANGE)
1594 ÆÐÅ°Áö Àμ⿡ À־ Kubelka-Munk Model À¯·¡ÀÇ »ê¶õ ¹× Èí¼ö °è¼ö¸¦ ÀÌ¿ëÇÑ »ö»ó ÀçÇö¼º ¿¹Ãø
³í¹®Áý : Çѱ¹Æ÷ÀåÇÐȸÁö(JOURNAL OF KOREA SOCIETY OF PACKAGING SCIENCE & TECHNOLOGY)
Çѱ¹Æ÷ÀåÇÐȸÁö(JOURNAL OF KOREA SOCIETY OF PACKAGING SCIENCE & TECHNOLOGY)
1593 ź¼Ò º¹ÇÕÀç ±â¹Ý ÀüÀÚÆÄ Â÷Æó ¹× °í¹æ¿­ ÀÏüÇü Çʸ§ ¿¬±¸µ¿Çâ
³í¹®Áý : ¸¶ÀÌÅ©·ÎÀüÀÚ ¹× ÆÐŰ¡ÇÐȸÁö(JORNAL OF THE MICROELECTRONICS AND PACKAGING SOCIETY)
¸¶ÀÌÅ©·ÎÀüÀÚ ¹× ÆÐŰ¡ÇÐȸÁö(JORNAL OF THE MICROELECTRONICS AND PACKAGING SOCIETY)
1592 Improved Adhesion of DLC Films by using a Nitriding Layer on AISI H13 Substrate
³í¹®Áý : Çѱ¹Ç¥¸é°øÇÐȸÁö(JOURNAL OF THE KOREAN INSTITUTE OF SURFACE ENGINEERING)
Çѱ¹Ç¥¸é°øÇÐȸÁö(JOURNAL OF THE KOREAN INSTITUTE OF SURFACE ENGINEERING)
1591 ¾Ï¹Ý Ä¿Æà ½ºÇø®Æà °ø¹ýÀÇ ÀûÁ¤ ¾ÐÀÔ·Â Ãß»êÀ» À§ÇÑ ºÐ¼®ÇØ
³í¹®Áý : Åͳΰú ÁöÇÏ°ø°£(TUNNEL AND UNDERGROUND SPACE)
Åͳΰú ÁöÇÏ°ø°£(TUNNEL AND UNDERGROUND SPACE)
1590 ÀÏÃà¾ÐÃà°­µµ¿¡ ¹ÌÄ¡´Â ¾Ï¼®½ÃÆíÀÇ Çü»óÈ¿°ú °íÂû ¹× ·ÎµåÇì´õ ±¼ÁøÀ² ¿¹Ãø¸ðµ¨ ¼öÁ¤
³í¹®Áý : Åͳΰú ÁöÇÏ°ø°£(TUNNEL AND UNDERGROUND SPACE)
Åͳΰú ÁöÇÏ°ø°£(TUNNEL AND UNDERGROUND SPACE)
1589 Highly sensitive, selective, and rapid response colorimetric chemosensor for naked eye detection of hydrogen sulfide gas under versatile conditions: Solution, thin-film, and wearable fabric
³í¹®Áý : SENSORS AND ACTUATORS B-CHEMICAL
SENSORS AND ACTUATORS B-CHEMICAL
1588 Review on the Wire Arc Additive Manufacturing Process and Trends in Non-ferrous Alloys
³í¹®Áý : ´ëÇÑ¿ëÁ¢Á¢ÇÕÇÐȸÁö(JOURNAL OF WELDING AND JOINING)
´ëÇÑ¿ëÁ¢Á¢ÇÕÇÐȸÁö(JOURNAL OF WELDING AND JOINING)
1587 Dimension Precision and Uniformability Depending on the Interpass Distance Variation of Automated-Wire Arc Additive Manufacturing using 5 Cr-4 Mo Tool Steel Alloy
³í¹®Áý : ´ëÇÑ¿ëÁ¢Á¢ÇÕÇÐȸÁö(JOURNAL OF WELDING AND JOINING)
´ëÇÑ¿ëÁ¢Á¢ÇÕÇÐȸÁö(JOURNAL OF WELDING AND JOINING)
1586 »çÃ⼺Çü°øÁ¤¿¡¼­ CAE ±â¹Ý Ç°Áú µ¥ÀÌÅÍ¿Í ½ÇÇè µ¥ÀÌÅÍÀÇ ÅëÇÕ ÇнÀÀ» ÅëÇÑ ÀΰøÁö´É Ç°Áú ¿¹Ãø ¸ðµ¨ ±¸Ãà¿¡ ´ëÇÑ ¿¬±¸
³í¹®Áý : Çѱ¹±ÝÇü°øÇÐȸÁö(JOURNAL OF THE KOREA SOCIETY OF DIE & MOULD ENGINEERING)
Çѱ¹±ÝÇü°øÇÐȸÁö(JOURNAL OF THE KOREA SOCIETY OF DIE & MOULD ENGINEERING)
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