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³í¹®ÀÚ·á ´Ù¿î·Îµå Àüü °Ô½Ã¹° : 4165 °Ç
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4015 Effect of Cable Length on Welding Quality in Asynchronous Tandem Gas Metal Arc Welding
³í¹®Áý : ´ëÇÑ¿ëÁ¢Á¢ÇÕÇÐȸÁö
´ëÇÑ¿ëÁ¢Á¢ÇÕÇÐȸÁö
4014 Recent Research Trend of Resistance Spot Welding Quality Monitoring Technology in Korea
³í¹®Áý : ´ëÇÑ¿ëÁ¢Á¢ÇÕÇÐȸÁö
´ëÇÑ¿ëÁ¢Á¢ÇÕÇÐȸÁö
4013 Recent Research Trend of Arc Welding Quality Monitoring Technology in Korea
³í¹®Áý : ´ëÇÑ¿ëÁ¢Á¢ÇÕÇÐȸÁö
´ëÇÑ¿ëÁ¢Á¢ÇÕÇÐȸÁö
4012 Toxicity and Biodistribution of Fragmented Polypropylene Microplastics in ICR Mice
³í¹®Áý : INTERNATIONAL JOURNAL OF MOLECULAR SCIENCES
INTERNATIONAL JOURNAL OF MOLECULAR SCIENCES
4011 Production of 1,2-propanediol from glycerol in Klebsiella pneumoniae GEM167 with flux enhancement of the oxidative pathway
³í¹®Áý : BIOTECHNOLOGY FOR BIOFUELS AND BIOPRODUCTS
BIOTECHNOLOGY FOR BIOFUELS AND BIOPRODUCTS
4010 Influence of operating pressure on combustion and heat transfer in pressurized oxy-fuel combustion evaluated by numerical modeling
³í¹®Áý : INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
4009 Macroscale and microscale structural mechanisms capable of delaying the fracture of low-temperature and rapid pressureless Ag sintered electronics packaging
³í¹®Áý : MATERIALS CHARACTERIZATION
MATERIALS CHARACTERIZATION
4008 Thermo-mechanical fatigue induced unexpected strain hardening of Cu clip wiring on transfer-mold type EV power modules
³í¹®Áý : International Journal of Fatigue
International Journal of Fatigue
4007 Microstructure and Mechanical Properties of Hastelloy X Fabricated Using Directed Energy Deposition
³í¹®Áý : Metals
Metals
4006 Multiscale framework for prediction of residual stress in additively manufactured functionally graded material
³í¹®Áý : Additive Manufacturing
Additive Manufacturing
4005 Hierarchically porous hydrogel electrolyte prepared from interpenetrating polymer networks for flexible Zn-Air batteries
³í¹®Áý : Energy Storage Materials
Energy Storage Materials
4004 Interfacial microstructure and brittle fracture behavior of Sn-based solder on novel nickel-less DEG and EPIG surface ?nishes
³í¹®Áý : JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
4003 Thermo?Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish
³í¹®Áý : Materials
Materials
4002 Effect of Mg remelting and mechanical hooks of steel on the mechanical and fatigue responses of resistance element welded AZ31/DP780 joints: Experimental, FEM and thermodynamic calculation studies
³í¹®Áý : Journal of Materials Research and Technology-JMR&T
Journal of Materials Research and Technology-JMR&T
4001 ±¤°³½ÃÁ¦ ¹× Èñ¼®Á¦ ÇÔ·®¿¡ µû¸¥ Æú¸®¿ì·¹Åº ¾ÆÅ©¸±·¹ÀÌÆ® ±â¹Ý Àº³ª³ë Àü±Ø Àü»ç¿ë Á¢Âø Á¶¼º¹°ÀÇ UV °æȭƯ¼º º¯È­
³í¹®Áý : POLYMER-KOREA
POLYMER-KOREA
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